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1N5532CUR-1中文资料

元器件交易网http://doc.xuehai.net

IN5518BUR-1 thru 1N5546BUR-1 (or MLL5518B-1 thru MLL5546B-1) Low Voltage Surface Mount 500 mW Avalanche Diodes

SCOTTSDALE DIVISION

DESCRIPTION The 1N5518BUR-1 thru 1N5546BUR-1 series of 0.5 watt glass surface mount Zener voltage regulators provides a selection from 3.3 to 33 volts in standard 5% tolerances as well as tighter tolerances identified by different suffix letters on the part number. These have an internal-metallurgical-bond option as identified by the“–1” suffix. This internally bonded Zener package construction is also in JAN, JANTX, and JANTXV military qualifications. Microsemi also offers numerous other Zener products to meet higher and lower power applications.

APPEARANCE

WWW . Microsemi .C OM

DO-213AA IMPORTANT: For the most current data, consult MICROSEMI’s website: http://doc.xuehai.net

FEATURES Surface mount equivalent to JEDEC registered 1N5518 thru 1N5546 series Internal metallurgical bond with the“-1” suffix Also available in JAN, JANTX, and JANTXV qualifications per MIL-PRF-19500/437 by adding the JAN, JANTX, or JANTXV prefixes to part numbers for desired level of screening; (e.g. JANTX1N4099UR-1, JANTXV1N4109CUR-1, etc.) Nonbonded types also available without the“-1” suffix for both the axial and surface mount packages DO-7 or DO-35 glass body axial-leaded Zener equivalents also available per JEDEC registration with part numbers 1N5518 thru 1N5546 on separate data sheets

APPLICATIONS/ BENEFITS Regulates voltage over a broad operating current and temperature range Extensive selection from 3.3 to 33 V Standard voltage tolerances are plus/minus 5% with a“B” suffix, e.g. 1N5518BUR-1, etc. Tight tolerances available in plus or minus 2% or 1% with C or D suffix respectively, e.g. 1N5518CUR-1, 1N5518DUR-1, etc. Hermetically sealed surface mount package Nonsensitive to ESD per MIL-STD-750 Method 1020 Minimal capacitance (see Figure 3) Inherently radiation hard as described in Microsemi MicroNote 050

MAXIMUM RATINGS Operating and Storage temperature: -65 C to+175ºC Thermal Resistance: 100ºC/W junction to end cap, or 250ºC/W junction to ambient when mounted on FR4 PC board (1 oz Cu) with recommended footprint (see last page) Steady-State Power: 0.5 watts at end cap temperature TEC< 125oC or at ambient TA< 50ºC when mounted on FR4 PC board as described for thermal resistance above (see Figure 2 for derating) Forward voltage@200 mA: 1.1 volts Solder Temperatures: 260ºC for 10 s (max) º

MECHANICAL AND PACKAGING CASE: Hermetically sealed glass DO-213AA (SOD80 or MLL34) MELF style package TERMINALS: End caps tin-lead plated solderable per MIL-STD-750, method 2026 POLARITY: Cathode indicated by band where diode is to be operated with the banded end positive with respect to the opposite end for Zener regulation MARKING: cathode band only TAPE& REEL option: Standard per EIA-481-1-A wi

th 12 mm tape, 2000 per 7 inch reel or 5000 per 13 inch reel (add“TR” suffix to part number) WEIGHT: 0.04 grams See package dimensions on last page

1N5518BUR– 1N5546BUR

Copyright 2003 10-31-2003 REV B

Microsemi Scottsdale Division 8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503

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1N5532CUR-1中文资料

1N5532CUR-1中文资料

1N5532CUR-1中文资料

1N5532CUR-1中文资料

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