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TSX Premium controller automatesnew wafer CMP machine

Microelectronics:

Introduction.

A global maunafcturer of wafer manufacturing equipment contactedGroupe Schneider about providing a control system for a redesignedCMP machine they were developing. This manufacturer is one of the top3 suppliers in its chosen fields of activity which include CD production,Rapid Thermal Processing, Photomask production and Advanced WetProcesses.

FRANCE

The Objective

The Chemical Mechanical Planarisation (CMP) division of this customeris based in France. It builds CMP machines whose purpose is to planarisethe surface of a silicon wafer. As integrated circuits become more complex,the number of physical layers on a wafer is increasing. With the addition ofeach layer, the wafer surface becomes more uneven resulting in geometri-cal inaccuracies in subsequent layers. The CMP process carries out a

combined mechanical and chemical polish/etch on the wafer surface usingspecially prepared slurries, in order to planarise the uneven wafer surfacein preparation for the subsequent layers. CMP machines are also used toremove metal layers down to the underlying silicon in order to leave only

the metal interconnects between transistors.

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