HCI2012-10NJ中文资料

=

Multilayer Ceramic Chip Inductor (High frequency application) = HCI Series =

FEATURES

Advanced monolithic construction with high frequency ceramic and conductive materials

Excellent high Q characteristics

Support operating frequency bands up to 10GHz

Excellent reliability

APPLICATIONS

Wireless communications, cellular phone, cordless phone, pager, etc.. Miscellaneous high-frequency circuits. EMI

countermeasure in high-frequency circuits.

SHAPES AND DIMENSIONS

D

201209 0805 2.00 ± 0.20 1.25 ± 0.20 0.85 ± 0.20 0.50 ± 0.30

201212 0805 2.00 ± 0.20 1.25 ± 0.20 1.25 ± 0.20 0.50 ± 0.30

1.60 ± 0.15 0.80 ± 0.15 0.80 ± 0.15 0.30 ± 0.20

1.00 ± 0.10 0.50 ± 0.10 0.50 ± 0.10 0.25 ± 0.10

Dimension in mm

PART NUMBER IDENTIFICATION SPECIFICATIONS

- Operating temperature range -55°C ~ +125°C - Storage conditions -40°C max, 70%RH

(1) (2) (3) (4)

Precautions

(1) Series name

(2) Dimensions L x W - After mounting components onto printed circuit board,

(3) Inductance Code do not apply stress through board bending or

(4) Tolerance Code mishandling

S = ± 0.3 nH - When hand soldering, apply solder iron to the printed

J ± 5 % circuit board only. Temperature of the iron tip should K ± 10 % not exceed 260°C with soldering time < 3 seconds. M ± 20% - Reflow soldering condition:

- 230 °C+/- 5°C (260 °C+/- 5°C for Pb free)

77HCI Series

第1页下一页