当前位置： 文档下载 > 所有分类 > 工程科技 > 电子/电路 > Q67050-A4102-A001中文资料3
SIGC12T120
IGBT Chip
FEATURES:
1200V Trench & Field Stop technology low turn-off losses short tail current
positive temperature coefficient easy paralleling
This chip is used for: power module Applications: drives
Chip Type
SIGC12T120
VCE 1200V
ICn 8A
Die Size 3.54 x 3.5 mm2
Package sawn on foil
Ordering Code Q67050-A4102-A001
MECHANICAL PARAMETER: Raster size Emitter pad size Gate pad size Area total / active Thickness Wafer size Flat position
Max.possible chips per wafer Passivation frontside Emitter metallization Collector metallization Die bond Wire bond
Reject Ink Dot Size
Recommended Storage Environment
3.54 x 3.5 2.028 x 2.028 1.107 x 0.702 12.4 / 6.9 140 150 0
1200 pcs Photoimide 3200 nm AlSiCu
1400 nm Ni Ag –system
suitable for epoxy and soft solder die bonding
electrically conductive glue or solder
Al, <500µm 0.65mm ; max 1.2mm
store in original container, in dry nitrogen, < 6 month at an ambient temperature of 23°C
mm µm mm grd
2
mm
Q67050-A4050-A001中文资料 隐藏>> 元器件交易网www.cecb2b.com SIGC81T120R2CS IGBT Chip in NPT-technology FEATURES: ? 1200V NPT technology 175?m chip...
Q67050-A4187-A001中文资料_电子/电路_工程科技_专业资料。元器件交易网www.cec...Unit ns tbd A tbd nC tbd A / ?s tbd 1 Edited by INFINEON ...
Q67050-T6中文资料_电子/电路_工程科技_专业资料。BSS 159 Preliminary data SIP...8 VGS = -10 V, ID = 250 ?A Gate threshold voltage VGS(th) -3 VDS...
Q67050-A4185-A001中文资料 隐藏>> 元器件交易网www.cecb2b.com Preliminary ...Unit ns tbd A tbd nC tbd A / ?s tbd 1 Edited by INFINEON ...
Q67050-A4190-A001中文资料 隐藏>> 元器件交易网www.cecb2b.com Preliminary ...A Maximum repetitive forward current limited by Tjmax Operating junction and ...
Q67050-A4160-A001中文资料 隐藏>> 元器件交易网www.cecb2b.com SIGC61T60NC...Q67050-A4160A001 MECHANICAL PARAMETER: Raster size Area total / active ...
Q67050-A4188-A001中文资料 隐藏>> 元器件交易网www.cecb2b.com SIGC101T170...Edited by INFINEON Technologies AI PS DD HV3, L 7771-A, Edition 2, 04...
Q67050A4048-A001 MECHANICAL PARAMETER: Raster size Emitter pad size Gate pad size Area total / active Thickness Wafer size Flat position Max.possible ...
Q67050-A4167-A001中文资料 隐藏>> 元器件交易网www.cecb2b.com Preliminary ...Unit ns A 21.5 970 nC 1770 A / ?s 4.4 1 5 Edited by INFINEON ...
drives G E Chip Type SIGC128T170R3 VCE ICn Die Size 11.33 x 11.33 mm2 Package sawn on foil Ordering Code Q67050A4189-A001 1700V 100A MECHANICAL...
我要评论